Method for bonding a porous medium to a substrate

摘要

A method for bonding a porous medium to a substrate is provided which includes contacting a porous medium with a surface of a substrate, impregnating the porous medium with a bonding composition, maintaining the impregnated porous medium in contact with the substrate surface until the substrate surface is at least slightly dissolved in the bonding composition without dissolving the porous medium, and passing the bonding composition through the impregnated porous medium towards the substrate and subsequently away from the surface of the substrate to remove bonding composition containing dissolved substrate from a portion of the porous medium to minimize blockage of pores in the porous medium.