| 摘要 |
To facilitate the registered connection between a BGA package and an associated multi-tiered circuit board, a spaced series of vias are formed transversely through the board substrate between its opposite first and second sides. A spaced series of relatively shallow, circularly cross-sectioned socket areas, offset from the vias, are also formed on the first side of the circuit board. The sockets have diameters slightly larger that those of the generally ball-shaped leads of the BGA package, and are positioned on the same centerline pattern as the leads. After the vias and sockets are formed, a metal plating material is deposited on their interiors and around their open ends on the first board side, with the plating being extended across the first board side between associated socket and via pairs. A solder mask is then extended along the first board side, outwardly over the plating material thereon, the mask having circular cutout areas coaxial with the plated sockets and having diameters slightly larger than the diameters of the plated sockets. Using a high precision pick and place machine, the BGA package is placed against the first board side in a manner causing the BGA leads to partially enter the plated sockets, the sockets facilitating the registration between the BGA leads and the lead connection areas of the plating material. Finally, the socket-received BGA leads are soldered to the plating portions of their associated sockets.
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