| 摘要 |
PURPOSE:To obtain an epoxy resin composition improved in storage stability at ordinary temperatures and curability by mixing a specified molten mixture with an epoxy resin and an inorganic filler. CONSTITUTION:Triphenylphosphine-triphenylborane in an amount of 0.3-1.5wt.% is mixed with a flexible phenolic resin curing agent comprising a compound of formula II (wherein R is p-xylylene) and/or a compound of formula III (wherein R is a residue derived by removing the two phenolic moieties from dicyclopentadienediphenol, terpenediphenol, cyclopentadienediphenol or cyclohexanondiphenol; and (n) is 1-10) by melting for about 30min at the softening point of the curing agent or above. This mixture is mixed with 50-100wt.%, based on the total epoxy resin amount, epoxy resin of formula IV (wherein R1 to R8 are each H, a halogen or an alkyl) and 70-90wt.% inorganic filler. |
