发明名称 |
Resin sealed type semiconductor device |
摘要 |
A resin sealed semiconductor device includes a current-detecting resistance for detecting current flowing in a semiconductor element that is a metallic resistance having a coefficient of thermal expansion almost equal to that of the lead frame. Compared to a conventional ceramic chip resistance, its coefficient of thermal expansion differs less from that of the lead frame, thereby preventing deterioration caused by heat stress.
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申请公布号 |
US5459350(A) |
申请公布日期 |
1995.10.17 |
申请号 |
US19940318447 |
申请日期 |
1994.10.05 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
DATE, SHOJI;HONDA, ZIRO;NAKANO, TOSHIYA;KATO, HAZIME |
分类号 |
G01R15/14;H01L23/48;H01L23/495;H01L23/50;(IPC1-7):H01L23/16 |
主分类号 |
G01R15/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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