发明名称 SEPARATING METHOD OF LOSS SYNTHETIC RESIN FROM LEAD FRAME FOR ELECTRONIC PART, AND SEPARATION DEVICE USING THE METHOD
摘要 PURPOSE:To reduce occurrence of a cracking in a resin mold part in a lead frame, by a method wherein after the lead frame is bent in the direction of a stuck surface side of loss synthetic resin out of both front and rear surfaces of the lead frame, the lead frame is bent in its opposite direction. CONSTITUTION:The top of a resin mold part M is pressed by a pressing pin 2, through which the bottom of the resin mold part M is forced to abut against a substrate 1 so as to follow after a groove surface of the substrate 1. At that time, the lead frame L is in a bent state bending downward by taking a supporting position of the lead frame L as a fulcrum. A suction face of a suction pad is held by sucking by abutting against a cull R1, the lead frame L is conveyed to the substrate 3 in the second unit and the top of the resin mold part M is pressed by the pressing pin similarly to the first unit. The bottom of the resin mold part M is forced to abut against the substrate so as to follow after the groove surface of the substrate 1. At that time, a connecting part K becomes a condition bent upward.
申请公布号 JPH07266383(A) 申请公布日期 1995.10.17
申请号 JP19940061789 申请日期 1994.03.30
申请人 ROHM CO LTD 发明人 SAWAMURA TENDOU;KATAGAWA HIROSHI
分类号 H01L21/56;B29C45/38;B29L31/34;(IPC1-7):B29C45/38 主分类号 H01L21/56
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