| 摘要 |
In a device fabrication method, there are prepared a first substrate having registration patterns formed thereon and a second substrate having through bores formed therein and devices formed thereon through a separation layer. The two substrates are overlapped by viewing the registration patterns through the through bores. After the first substrate and the devices formed on the second substrate have been bonded, the devices are separated from the second substrate by selectively etching the separation layer, and are transferred to the first substrate.
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