发明名称 Semiconductor memory cell and fabrication process
摘要 A semiconductor memory cell (10) includes first and second cross-coupled driver transistors (13, 19) each having a source-drain region and a channel region formed in a first thin-film layer (36, 36'). First and second parallel opposed wordlines (20, 22) overlie a single-crystal semiconductor substrate (12) and the channel region (46) of each driver transistor overlies a portion of an adjacent wordline. A portion of the thin-film layer (36, 36') makes contact to the single-crystal semiconductor substrate (12) adjacent to the opposite wordline. The channel and source-drain regions of first and second load transistors (15, 21) are formed in a second thin-film layer (64) which overlies the driver transistors (13, 19). The load transistors (15, 21) are cross-coupled to the driver transistors (13, 19) through common nodes (31, 33).
申请公布号 US5459688(A) 申请公布日期 1995.10.17
申请号 US19940245124 申请日期 1994.05.17
申请人 MOTOROLA INC. 发明人 PFIESTER, JAMES R.;HAYDEN, JAMES D.
分类号 H01L21/768;H01L21/8244;H01L27/11;H01L27/12;(IPC1-7):H01L29/78;H01L27/01 主分类号 H01L21/768
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