| 摘要 |
PURPOSE:To improve connecting defect and strength of stitch bonding when electrodes of a semiconductor device like an integrated circuit are connected to leads via coated bonding fine wires and to stably improve continuous bondability without tail disconnection of the wire. CONSTITUTION:An edge of a small hole 2 of an end of a capillary 1 in which a coated bonding fine wire is drawn out is formed in a circular arc state. A radius IR of curvature of the circular arc state is set to 1/6 to 2/3 of a diameter H of a minimum diameter of the hole 2. Thus, an ultrasonic output and a pressing pressure can be enhanced without retaining a coating material at the connecting part, and the wire can be practically realized. |
