| 摘要 |
<p>PURPOSE:To realize a multi-chip module type semiconductor device having a good yield of its plating process, by giving the cheap means for restricting the moving range of an armor-plating probe. CONSTITUTION:Outside a seal ring, a plating-electrode pad 13 is provided on the same principal surface of a ceramic multilayer board 1 as a thin film multilayer interconnection part 5 is formed, and in the periphery of the plating- electrode pad 13, guides 14 for a plating probe are formed by the use of the same material and the same process as the plating-electrode pad 13, when the thin film multilayer interconnection part 5 is formed. Thereby, the plating- electrode pad 13 is prevented from generating a contact failure due to its embedment in a polyimide, and also, the guides 14 for a plating probe are manufactured at a low price. As a result, the yield of the plating process of a semiconductor device is improved, and its cost can be reduced conjointly with the cheap guides 14.</p> |
