| 摘要 |
<p>PURPOSE:To provide a method for manufacturing a substrate for mounting multilayer electronic parts with less number of processes, an improved adhesion between insulation bases, and less entire thickness. CONSTITUTION:Solder resist 7 is applied to the surface of an inner-layer substrate 22 excluding a pad part 511 of an inner-layer circuit 51 and an area for forming a part for mounting electronic parts. Then, a mask material 1 is applied to the pad part 511 and an area for forming a mounting part. And then, an uppermost layer substrate 23 and a lowermost layer substrate 21 are laminated on the upper and lower parts of the inner-layer substrate 22, respectively, via a prepreg adhesive 6. Then, the substrates are heated and pressed to manufacture a pressed body 29. Then, a surface circuit 52 is formed on the pressed body 29 and a recessed electronic parts mounting part is formed. Then, the mask material 1 remaining on the surface of the pad part 511 is eliminated to expose the pad part 511.</p> |
