| 摘要 |
PURPOSE:To effectively avoid the reflow cracking caused between a metallic sheet and a mold resin at the solder reflowing time by improving the bonding properties between the metallic sheet and the mold resin. CONSTITUTION:A copper alloy sheet 2 to be a heat spreader is laminated on the title multiple layer lead frame 1. Besides, a surface roughened layer 8 is formed on the copper alloy sheet 2 coming into no contact with the lead frame 1. On the other hand, a bonding agent 7 is provided on the copper alloy sheet 2 coming into contact with the lead frame l so as to bond a semiconductor element 5 on the lead frame l. At this time, the surface roughened layer 8 is formed by AC roughening process, electrolytic roughening process or black color oxidation roughening process. Furthermore, either thermoplastic bonding agent to the bonding agent or thermosetting bonding agent may be applicable to the bonding agent 7. Althrough the copper alloy sheet 2 having the self-contained type in a mold resin 4 may be further corrosion preventively processed after performing the surface roughening processes. |
