| 摘要 |
<p>PURPOSE:To realize the title lead frame and semiconductor package capable of realizing the fine pitching and high reliable package. CONSTITUTION:The title sealed semiconductor package is composed of a lead frame 5 wherein electrode blocks 3 comprising metallic sheets 1 and insulating layers 2 alternately arranged at a specific pitch internally or externally installed with the part ends of metallic sheets 1 exposed on the periphery of an insulator 4 as well as a circuit board comprising the lead frame 5 whereon IC chips are packaged to be connected.</p> |
