| 摘要 |
<p>PURPOSE:To provide the information card which can improve the bending rigidity by being thinly formed by reducing the entire thickness. CONSTITUTION:Concerning the information card, a card substrate 4 is formed almost equally or less than the thickness of a semiconductor device 6 for information processing, a projecting part 12 is formed by projecting one part on one side face 10 of the card substrate 4, and a recessed part 16 for incorporating the semiconductor device 6 for information processing is formed by recessing the other side face of the card substrate 4 corresponding to this projecting part 12. On the other hand, a projecting part is formed by projecting one part near a display part 20 to be formed on one side face of the card substrate 4, and a recessed part for incorporating the semiconductor device 6 for information processing is formed by recessing the other side face of the card substrate 4 corresponding to this projecting part. Further, a projecting part is formed by projecting one part on one side face 10 of the card substrate 4, a recessed part for incorporating the semiconductor device 6 for information processing is formed by recessing the other side face of the card substrate 4 corresponding to this projecting part, and a reinforced part for improving the bending rigidity of the card substrate 4 is formed by projecting one part on one side face around the projecting part at least.</p> |
