发明名称 ELECTRONIC PART MOUNTING METHOD OF PRINTED WIRING BOARD
摘要 PURPOSE:To reduce the number of soldering man-hours and to simplify manufacturing process when mounting electronic parts where surface-mount parts and insert parts are mixed to a printed wiring board. CONSTITUTION:When cream solder C is applied to the parts mounting surface of a single-sided printed wiring board P by a squeegee 30 using a metal mask 20 where a thin-walled opening 26 and a thick opening 28 protrude corresponding to the mounting holes of surface mount parts and connectors, the cream solder C is loaded to a mounting hole 40 of the connectors in the similar manner as the cream solder C is laid out at the soldering position of the surface mount parts. The surface mount parts and connectors are fitted to the single-sided printed wiring board P in this state and a final treatment for heating and treating it with a reflow oven is conducted thus achieving a soldering state similarly as the soldering of connectors with an automatic soldering bath requiring a separate heat treatment.
申请公布号 JPH07263857(A) 申请公布日期 1995.10.13
申请号 JP19940076537 申请日期 1994.03.22
申请人 MELCO:KK 发明人 YAMADA KOJI
分类号 H05K13/04;H05K3/12;H05K3/34 主分类号 H05K13/04
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