CUTTING APPARATUS OF OUTER SEMICONDUCTIVE LAYER

摘要

PURPOSE:To provide a cutting apparatus of an outer semiconductive layer with good performance and uniform cutting quality without a variation in cut face part of an outer semiconductive layer. CONSTITUTION:A cutting apparatus of an outer semiconductive layer can be mounted on and removed from an exposed part of a semiconductive layer 2 with a given space in an axial direction of a power cable. The cutting apparatus has a blade 34 for cutting the semiconductive layer 2 when the cutting apparatus goes and returns in an axial direction of the power cable. The blade 34 made of metal has an edge angle (alpha) of 0 to 10 deg., a clearance angle (beta) of 0 to 3 deg., and a cutting angle of 0 to 23 deg..