| 摘要 |
The invention describes a process for coating a non-solderable surface with a solderable metallised layer. In prior art processes, a preliminary step to destroy the surface layer of oxide is required before the actual metallisation step itself, especially for rapidly oxidising surfaces like aluminium, which is difficult to deal with in plasma etching or aggressive chemical pickling. In the process of the invention, the oxide layer is broken up and a seeding material is deposited easily in a single step. To this end, a seeding material on a substrate is transferred to the aluminium surface by high-energy radiation, the oxide layer being preliminarily broken up by the radiation and the particles of seeding material excited thereby. Any desired metallisation structure may quickly and accurately be provided with seeding material using a device for deflecting the radiation in relation to the non-solderable surface. Currentless, economical mass bath processes are eminently suitable for the subsequent selective metallisation of the seeded surface regions. |
