A securing unit for securing at least two different substrates spaced apart at a predetermined distance comprising a first securing portion for securing a first base plate, a second securing portion which forms an arrow shaped head and for securing a second base plate, and a support base portion for supporting said first and second securing portions in which the height of the first securing portion of the securing unit has been remarkably reduced. With this construction, the projection of the first securing portion of the unit is not impaired when removing unnecessary remnants or solder or when cleaning the surface of the first base plate, while the securings of the base plates by the first and second securing portions of the securing unit according to the present invention has been remarkably increased.
