发明名称 SOLDERING RESIST INK COMPOSITION
摘要 <p>PURPOSE:To obtain a soldering resist ink compsn. capable of dilution and development with water and giving a cured body excellent in characteristics. CONSTITUTION:This soldering resist ink compsn. is developable with water and contains a compd. (A) having a radical-polymerizable group and a tert. amino group in one molecule, a water-soluble org. acid (B) having one or more hydroxyl groups or ether bonds and two or more carboxyl groups in one molecule, a photopolymn. initiator (C) and a heat curing agent (D) selected from among epoxy resin, melamine resin and a blocked polyisocyanate compd. as essential components. A compd. having a radical-polymerizable group, an epoxy group and a/tert. amino group may be contained in place of the compd. A.</p>
申请公布号 JPH07261385(A) 申请公布日期 1995.10.13
申请号 JP19940046992 申请日期 1994.03.17
申请人 AJINOMOTO CO INC 发明人 YOKOTA TADAHIKO;NAKAMURA SHIGEO;MASHITA ATSUSHI
分类号 G03F7/004;C08F2/48;C09D11/00;G03F7/027;G03F7/028;G03F7/032;G03F7/038;H05K3/06;H05K3/18;H05K3/28;(IPC1-7):G03F7/027 主分类号 G03F7/004
代理机构 代理人
主权项
地址