Surface treatment of polyimide(s) to improve adhesion, e.g. to epoxy]

摘要

A process for the treatment of polyimide (PI) surfaces comprises (a) immersing the PI in an amine soln. and (b) drying the treated PI. A pref. PI is obtd. by imidising PMDA-ODA-polyamide-acid at 100,200 and 300 deg C (1 hr. at each temp.). This PI is then immersed for 5 mins. in a 0.5 wt./vol.% soln. of amine and dried; pref. combinations of amine, solvent and drying conditions ( deg C/time) are: TETA/isopropanol/150/1 hr., NPDA/water/80/1 hr., (TMAH or TBAH)/water/150/1 hr., (HA, EDA, PDA, BDA, HDA, TETA, TEPA or PEHA)/water/80/1 hr. In the case of polyether-imide, treatment comprises immersion for 5 mins., in a 0.5 wt./vol.% aq. soln. of HA, EDA, PDA, BDA or HDA and drying for 1 hr. at 80 deg C.