发明名称 |
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE |
摘要 |
An epoxy resin composition for encapsulating a semiconductor device comprises (i) an epoxy resin (A) comprising at least one of a bifunctional epoxy resin (a1) having a biphenol skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler comprising fused silica (C) consisting of 97 to 50 wt% of crushed fused silica (C1) of a mean particle diameter not more than 10 mu m and 3 to 50 wt% of spherical fused silica (C2) of a mean particle diameter not more than 4 mu m, wherein the mean particle diameter of the spherical fused silica is smaller than the mean particle diameter of the crushed fused silica, and the amount of the filler is 75 to 90 wt% of the total weight of the composition. |
申请公布号 |
KR950011902(B1) |
申请公布日期 |
1995.10.12 |
申请号 |
KR19910005291 |
申请日期 |
1991.04.02 |
申请人 |
TORAY INDUSTRIES INC. |
发明人 |
HONDA, SHIRO;SAWAMURA, YASUSHI;TANAKA, MASAYUKI;KAYABA, KEIJI;TESHIBA, TOSHIHIRO |
分类号 |
C08G59/22;C08G59/24;C08K7/18;H01L23/29;(IPC1-7):C08L63/00;C08G59/20;C08K3/36 |
主分类号 |
C08G59/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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