Träger für Kupferfolien von flexiblen Leiterplatten.

摘要

Nonwoven fabrics or papers coated with the chemical crosslinking product of a) the 50%-strength aqueous dispersion of a thermally crosslinkable copolymer of acrylonitrile and styrene having a glass transition temperature of +33 DEG C and of b) the 60%-strength aqueous methylol-group-containing solution of an aminoplastic or phenolic plastic precondensate in combination with a halogen-free flame-protection system can be used as thermally stable substrates for copper foils of flexible circuit boards.