| 摘要 |
An electronic-component holder comprises an image superimposing device comprising a semitransparent mirror 34 and a plane mirror 36 that, in combination, horizontally reflect the images of two objects, one placed over the other, to the same point, an image extracting device 50 that reflects the partial images in the diagonal fields of the image superimposing device in opposite and horizontal directions, and a solid image reproducing device 84 that converts the image from the image extracting device into a picture signal that are disposed between a semiconductor device D and a printed circuit board C that is placed below the semiconductor device D. The image superimposing device combines the image of the lead L1 on the back of the semiconductor device D and that of the conductor pattern on the front of the printed circuit board C into one composite image. The image extracting device 50 conveys to the solid image reproducing device only a portion of the image of the semiconductor device extracted from the diagonal fields. The positioner is capable of positioning even larger electronic components with high precision without increasing the size of the optical system.
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