| 摘要 |
An arrangement for cooling electronic equipment in a space by using radiation transfer, wherein the equipment includes heat-emitting electronic components mounted on a circuit board or the like. According to the invention, each circuit board or the like is surrounded by a cold plate which is spaced from the circuit board. The surfaces of both the circuit board and the plate are treated so as to have a high IR-radiation coefficient, wherein heat is transferred from the hot circuit board to the relatively colder plate by radiation.
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