Disclosed is a method for promoting adhesion of cofired copper-based metallurgy and glass-ceramic dielectric including the step of adding powders of an alloying metal to the copper-based metallurgy prior to firing. Also disclosed is a metallizing paste exhibiting superior adhesion to glass-ceramics. The paste includes an organic carrier, copper powder and an alloying metal, which may be a non-copper metal powder or a copper-metal alloy. It is preferred that of the metal in the paste, the copper should make up 80-99 weight percent and the alloying metal should make up 1-20 weight percent.
申请公布号
DE69204340(D1)
申请公布日期
1995.10.05
申请号
DE1992604340
申请日期
1992.03.13
申请人
INTERNATIONAL BUSINESS MACHINES CORP., ARMONK, N.Y., US
发明人
DIPAOLO, NUNZIO, POUGHKEEPSIE, NEW YORK 12603, US;KUMAR, ANANDA HOSAKERE, HOPEWELL JUNCTION, NEW YORK 12533, US;WIGGINS, LOVELL BERRY, HOPEWELL JUNCTION, NEW YORK 12533, US