| 摘要 |
<p>The station includes a wafer supporting device for receiving and orienting the wafer to lie substantially horizontally. A wafer heating device is used for uniformly heating portions of the wafer comprising a bake plate above the wafer to confront the wafer in spaced relation when the wafer is brought into proximity with the heating device. A wafer cooling device is provided for uniformly cooling portions of the wafer comprising a generally flat surface portion to confront the wafer in spaced relation when the wafer is brought into proximity with the cooling device. The heating device is positioned above the cooling device.</p> |
