| 摘要 |
The connection system has one contact (14) coated with a liquid solder (10), before application to the second contact (11), by bringing the two electronic circuits (5,12) together, so that the liquid solder forms an electrical connection with the second contact. A liquid non-conductive bonding material (13), which is subsequently hardened, is then inserted between the electronic circuits, e.g. using a capillary effect. Pref. the application of the solder, the bringing together of the electronic circuits and/or the interconnecting of the contracts is effected in a protective gas atmosphere. A Ni layer, or a Au coated Ni layer is pref. applied to the first contact before application of the solder. <IMAGE> |
