| 摘要 |
An integrated circuit, for example a hybrid integrated circuit, including a circuit substrate (2) on which active and/or passive elements (6, 7, 7 min ) are formed, a lead frame (9) having a support plate (8) which has an opening (80a) therein and supports the circuit substrate (2) thereon, and a mold (4) of resin for packaging the circuit substrate (2), support plate (8), and inner leads (31) of the lead frame. A bottom surface of the circuit substrate (2) is exposed and made free to contact the mold resin through the opening (8a). The integrated circuit has a ratio of exposed bottom surface to total bottom surface greater than 50%, and preferably has a ratio of surface area of the circuit substrate (2) to principal surface area of the mold (4) greater than 60%. This structure relieves mechanical stress caused in the mold package and eliminates or reduces occurrences of crack defects in the mold. Further, an integrated circuit package structure for avoiding or reducing deformation thereof is provided in accordance with the invention in which mold thicknesses above (x1) and below (x2) the circuit substrate (2) are selectively chosen (Fig. 15(b)). Further, an integrated circuit package structure is provided in accordance with the invention in which elements can be mounted on both main surfaces of a base member (5) (Figs. 11). |
