Redundancy circuitry layout for a semiconductor memory device.

摘要

A Redundancy circuitry layout for a semiconductor memory device comprises an array (MAR) of programmable non-volatile memory elements (TF0,TF1) for storing the addresses of defective bit lines and word lines which must be functionally replaced respectively by redundancy bit lines and word lines; the redundancy circuitry layout is divided in identical layout strips (LS1-LS4) which are perpendicular to the array (MAR) of memory elements (TF0,TF1) and which comprise each a first and a second strip sides located at opposite sides of the array (MAR) of memory elements (TF0,TF1), the first strip side containing at least one programmable non-volatile memory register (CRRA,CRRB) of a first plurality for the selection of redundancy bit lines and being crossed by a column address signal bus (CABUS) running parallel to the array (MAR of memory elements (TF0,TF1), the second strip side containing one programmable non-volatile memory register (RRR) of a second plurality for the selection of redundancy word lines and being crossed by a row address signal bus (RABUS) running parallel to the array (MAR) of memory elements (TF0,TF1). <IMAGE>