| 摘要 |
<p>PURPOSE:To eliminate the asymmetry of an aluminum film formed on the alignment mark and thereby to prevent the reduction in alignment accuracy due to such asymmetry from occurring in the sputtering device. CONSTITUTION:This sputtering device, in which the sputtering of aluminum is performed while rotating the wafer 3 supported by the wafer holder 2, is provided with the top motion mechanism 10 for rotating the center of revolution 2a of the wafer holder 2 around one axis 11 with the axis 11 as the center while revolving the wafer holder 2 around the center of revolution 2a that is at a prescribed angle theta to the axis 11.</p> |
