| 摘要 |
PURPOSE:To form the external electrode of a precise and a complex pattern with high accuracy by covering a part of the external surface of the main body of an electronic component with a shielding material to form thin film electrode base layer in the external surface by means of physical evaporation and forming thereon an electrode surface layer having thickness which is not less than that of the electrode base layer by means of electrolytic plating. CONSTITUTION:A region except the end part of a main body 1 of an electronic component is covered with a mask for a pattern to form a thin film electrode base layer 2 by a physical evaporation such as sputtering or vacuum evaporation. After that, electrolytic plating is applied onto the electrode base layer 2 by using the electrode base layer 2 as an electrode for plating to form a film-like electrode surface layer 3 having a thickness which is not less than that of the electrode base layer. Thereby, an external electrode 4 of a highly precise and a complex pattern can be formed. |
