| 摘要 |
<p>PURPOSE:To reduce the size and thickness of a package and to facilitate automatic mounting using a bonding machine by bonding an electrode body to the electrode part of a semiconductor element, while facing each other, through a conductive adhesive and then sealing the surface of the semiconductor element. CONSTITUTION:A electrode body, i.e., a rubber lead 3, composed of Cu or Fe applied with Ni plating, for example, is bonded to an electrode part (ohmic electrode or wiring electrode) 5 formed on the surface of a semiconductor chip 1, while facing each other, through a conductive adhesive 6, e.g. Ag paste, and then the surface of the semiconductor chip 1 is sealed with an epoxy resin, for example, to produce a hexahedron. The electrode body(rubber lead) 3 has parallel planes where one plane is connected with the semiconductor chip 1 and the other plane is exposed. This structure reduces the size and thickness of package for a Hall element or an FET element while facilitating automatic mounting using a bonding machine.</p> |
