Phase change cooling of semiconductor power modules

摘要

Semiconductor wafer (22) and substrate (20) are enclosed in housing (12) on heat extracting base (14) . The space within the housing is filled with a phase change material (28) which absorbs heat at a transitional temperature below the critical temperature of the semiconductor wafer to absorb heat during peak loads. Wires (44) thermally couple the wafer (22) to the phase change material (28). Heat is extracted from both the semiconductor wafer and the phase change material through the base (14).