| 摘要 |
PURPOSE:To provide a semiconductor device in which the design can be modified easily in a short time when it is required to add power supply pins or signal pins. CONSTITUTION:The semiconductor device 1 is provided, on the chip 4 side, with I/O pads 5 for specified purposes arranged oppositely to the pins 3 on the frame 10 side arranged at least on a part of a package 2 wherein the number of the I/O pads 5 is set higher than that of the pins 3. |
