| 摘要 |
<p>PURPOSE:To provide a multilayer electronic component mounting board of a structure, wherein there is not the generation of a flowing-out fiber in an adhesive material and a bonding wire can be reliably bonded on a bonding pad, and a method of manufacturing the board. CONSTITUTION:An adhesive material 1 is made to interpose between an upper layer board 71 and a lower layer board 72 to form a multilayer board 79. The board 71 is provided with a through hole 15 for electronic component mounting part formation and the board 72 is provided with a wiring circuit having a bonding pad 53. The board 79 is provided with an electronic component mounting part 75, which is made to penetrate the above material 1, and the bonding pad provided on the board 72 is made to expose at the part 75. The material 1 consists of a base material 10 and adhesive resins 11 and 12 coated on the front and back side surfaces of the material 10. The adhesive resins are a bismale-imide triazine resin, an epoxy resin, a polyimide resin or the like.</p> |
