Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby

摘要

PCT No. PCT/EP92/02134 Sec. 371 Date Aug. 20, 1993 Sec. 102(e) Date Aug. 20, 1993 PCT Filed Sep. 14, 1992 PCT Pub. No. WO94/07267 PCT Pub. Date Mar. 31, 1994.A method for producing integrated circuit devices including the steps of producing a plurality of integrated circuits on a wafer, each of the integrated circuits including a multiplicity of pads and thereafter slicing the wafer, thereby to define a plurality of integrated circuit elements, and wherein the step of slicing exposes sectional surfaces of the multiplicity of pads. Apparatus for carrying out the method and integrated circuit devices are also described.