Method for obtaining metallurgical stability in integrated circuit conductive bonds

摘要

A method for electrically connecting integrated circuit copper-gold ball bond that connect a bond wire (18) with a bond pad (14) forms a palladium layer (16) in the electrical connection between the bond wire (18) and the bond pad (14). The connection avoids excessive stresses that arise from intermetallic formations between the bond wire (18) and the bond pad (14).