| 发明名称 |
Semiconductor device having complimentary bonding pads |
| 摘要 |
Among a plurality of pads disposed along four sides of a semiconductor chip, complementary pads connected to individual pads by conductors are provided for the pads situated near the corners of the semiconductor chip to allow different types of packages to be used with the single semiconductor chip.
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| 申请公布号 |
US5455460(A) |
申请公布日期 |
1995.10.03 |
| 申请号 |
US19940178344 |
申请日期 |
1994.01.06 |
| 申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
HONGO, KATSUNOBU;SHIBUTANI, HIDEKI |
| 分类号 |
H01L21/60;H01L23/485;H01L23/495;(IPC1-7):H01L23/48;H01L29/44;H01L29/52 |
主分类号 |
H01L21/60 |
| 代理机构 |
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