| 摘要 |
PURPOSE:To control the atom ratio of a dispersion plating layer to a desired value in dispersion plating to be executed by dispersing and suspending the powder of metal or nonmetal into a soln. dissolved with metal ions. CONSTITUTION:The plating metal 4 is put into a plating tank 1. A member 2 to be plated and an anode are opposed to each other and are immersed into this liquid 4. Negative voltage and positive voltage are impressed to this member 2 to be plated and this anode 3. The member 2 to be plated is vertically moved while the member is alternately brought into contact with the plating liquid 4 and an air bubble layer 4b thereabove. A settling layer 4a generated in the bottom of the plating tank 1 is sucked out by a pipe 5 and a pump 6 and is sprinkled onto the member from above the air bubble layer 4b. The member 2 to be plated is lowered down into the plating liquid and is subjected to plating. Next, the plating is executed while the member 2 to be plated is pulled up into the air bubble layer 4b. The layers where the amt. of the fine powder is relatively small and the layers where the amt. thereof is relatively large are alternately laminated when this operation is alternately repeated. The dispersion plating layer having the desired compsn. ratio is thus formed when the entire part is averaged. |
