| 摘要 |
<p>PURPOSE:To increase the packaging density by a method wherein the first surface packaging part is packaged on an inner layer wiring pattern exposed by a notch while the second surface packaging part is packaged on the surface of the wiring pattern so as to cover the first surface packaging part so as to laminatedly package the first second packaging parts. CONSTITUTION:A notch 12 is partly made on a board 2 having a wiring pattern exceeding two layers thereon so as to expose an inner layer wiring pattern 13 so that the first surface packaging part 19 may be packaged on this exposed inner layer wiring pattern 13 as well as to package the second surface packaging part 20 is to be packaged on the surface of the wiring patterns 7, 8 so as to cover the first surface packaging part 19.</p> |
