发明名称 Wave solder pallet
摘要 An apparatus for facilitating wave solder treatment and other handling of a circuit component during manufacture of the circuit component having first areas configured for wave solder treatment and second areas not configured for wave solder treatment. The apparatus comprises a substantially rigid frame generally symmetrical about a plane and defining an opening which traverses the frame intermediate a first side and a second side. The apparatus further comprises a masking member affixed to the frame and defining a plurality of apertures traversing the masking member to the opening in the frame. The apparatus also comprises a holding device for holding the circuit component in an operational location in fixed relation with the masking member and with the frame during wave solder treatment. Each of the first areas of the circuit component is substantially in register with an aperture of the masking member when the circuit component is in the operational location. Particular walls about the apertures have a ramp for affecting solder flow during wave solder treatment.
申请公布号 US5454505(A) 申请公布日期 1995.10.03
申请号 US19940312296 申请日期 1994.09.26
申请人 PARAGON ELECTRIC COMPANY, INC. 发明人 KEARNS, PHILLIP A.
分类号 B23K3/08;(IPC1-7):B23K3/00 主分类号 B23K3/08
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