| 摘要 |
PURPOSE:To provide a semiconductor device and a manufacturing method thereof in which a semiconductor element can be connected electrically with a substrate without requiring any bump electrode and eliminating the need of wire bonding. CONSTITUTION:The semiconductor device comprises a substrate 1 provided with a plurality of electrodes 2 on the surface thereof, a semiconductor element 3 provided, on the surface thereof, with a plurality of electrodes 4 corresponding to the plurality of electrodes 2 while facing therewith, and a conductor for connecting the plurality of corresponding electrodes 2, 4 electrically with each other. |
