| 摘要 |
A pitch lead frame and a method for manufacturing the same is disclosed herein. A preferred embodiment of a fine pitch lead frame is generally comprised of a plurality of fine pitch leads, a die pad area, and die pad area support arms. The leads are comprised of a base lead portion formed in an unetched region and a fine pitch lead tip portion formed in an etched region on an electrically conductive material. The base lead portions are substantially the same thickness as the conductive substrate and the lead tip portions are of a smaller thickness. Etching one or more region(s) on an electrically conductive substrate of a substantial uniform thickness to a fraction of the thickness of the unetched regions allows for the formation of fine pitch lead tips in the etched region(s). Some possible methods for forming the leads includes an additional etching, stamping out the leads with a finely tapered stamp tool punch or using conventional stamp tool punches in conjunction with finer stamp tool punches to create the fine pitch lead tips. There is also disclosed examples of various methods for forming the fine pitch lead frame in different configurations. |
