| 摘要 |
<p>A coating composition comprising a glue, a particulate material and a solvent, which imparts a surface microstructure to a coated object (29) is disclosed. The particulate material projects above the glue line (28) of the coated object creating the microstructure which provides boiling heat transfer enhancement. A horizontally oriented, rectangular surface immersed in FC-72, indicates up to an 85 % decrease in incipient superheat, a 70 % to 80 % reduction in nucleate boiling superheats, and a ∩109 % increase in the critical heat flux (CHF), beyond that of the non-painted surface. The enhanced surface heat transfer coefficients are four to nine times higher than those from the reference surface. The coatings are applicable to electronic component surfaces. A coated silicon test chip tested at subcooled (45 °C conditions using FC-72 had heat dissipation rates of ∩100 W/cm2 at junction temperatures of ∩85 °C, and the highest CHF observed was 159 W/cm2, 224 % higher than that from the untreated chip surface tested at saturated conditions.</p> |
