Herstellung zum Zusammensetzen von kleineren Abtast- oder Druckeinheiten, so dass eine längere Matrix produziert wird.

摘要

A process for fabricating a full width scanning or printing array (3) in which plural smaller scanning or printing chips (5) are bonded end-to-end onto an glass substrate (10) using a photocurable adhesive to form a subassembly (4), following which the subassembly is inverted and joined to a second substrate (6) having a conductive surface (8) using a conductive heat activated adhesive.