Sputter coating appts.,申请号DE19951009440-传众专利搜索

发明名称	Sputter coating appts.
摘要	The substrate (4a) is loaded in a sputter coating chamber onto a horizontal support plate (4b) having cooling and heating means. The plate (4b) is then moved into a vertical position opposite the target (16) by a drive mechanism (13).
申请公布号	DE19509440(A1)	申请公布日期	1995.09.28
申请号	DE19951009440	申请日期	1995.03.16
申请人	HITACHI, LTD., TOKIO/TOKYO, JP	发明人	KAMEI, MITSUHIRO, TAKAHAGI, IBARAKI, JP;SETOYAMA, EIJI, HITACHI, IBARAKI, JP;UMEHARA, SATOSHI, HITACHIOOTA, IBARAKI, JP
分类号	C23C14/34;C23C14/50;C23C14/56;H01J37/34;H01L21/203;H01L21/677;(IPC1-7):H01J37/34;C23C14/22	主分类号	C23C14/34
代理机构		代理人
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