Additional plasma cathode sputtering method for production of thin films

摘要

The additional plasma cathode sputtering method for production of thin films is characterised by the following facts: (a) the deposit is produced by the plasma of one or several cathodes; (b) at the same time, an additional plasma is produced at or in front of each substrate in such a way that, independently of the deposition rate, energy-adjustable bombardment of each substrate with particles is possible.