发明名称 Bandspannvorrichtung für einen Halbleiterproduktionsapparat
摘要 In a tape extension device for a semiconductor-producing apparatus having a device 5 for tensioning a tape 2, which is withdrawn from a roll 1, in a down-web direction above a semiconductor wafer 3, the tape extension device comprises a lateral tensioning device 6. The lateral tensioning device includes clamp means 17 for clamping each side edge of the tape in a cross-web direction and computer-controlled drive means 18 for moving the clamp means in the cross-web direction away from each other to tension the tape. The tape is then attached to the semiconductor wafer 3 and frame 4 avoiding wrinkles and a section of the tape is severed. <IMAGE>
申请公布号 DE4423879(A1) 申请公布日期 1995.09.28
申请号 DE19944423879 申请日期 1994.07.07
申请人 TEIKOKO SEIKI K.K., SAKAI, OSAKA, JP 发明人 LEE, MASAHIRO, OBU, AICHI, JP
分类号 H01L21/683;B65H23/022;B65H23/04;H01L21/00;H01L21/301;(IPC1-7):H01L21/68;H01L21/78;B65H23/02 主分类号 H01L21/683
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