发明名称 |
Bandspannvorrichtung für einen Halbleiterproduktionsapparat |
摘要 |
In a tape extension device for a semiconductor-producing apparatus having a device 5 for tensioning a tape 2, which is withdrawn from a roll 1, in a down-web direction above a semiconductor wafer 3, the tape extension device comprises a lateral tensioning device 6. The lateral tensioning device includes clamp means 17 for clamping each side edge of the tape in a cross-web direction and computer-controlled drive means 18 for moving the clamp means in the cross-web direction away from each other to tension the tape. The tape is then attached to the semiconductor wafer 3 and frame 4 avoiding wrinkles and a section of the tape is severed. <IMAGE>
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申请公布号 |
DE4423879(A1) |
申请公布日期 |
1995.09.28 |
申请号 |
DE19944423879 |
申请日期 |
1994.07.07 |
申请人 |
TEIKOKO SEIKI K.K., SAKAI, OSAKA, JP |
发明人 |
LEE, MASAHIRO, OBU, AICHI, JP |
分类号 |
H01L21/683;B65H23/022;B65H23/04;H01L21/00;H01L21/301;(IPC1-7):H01L21/68;H01L21/78;B65H23/02 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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