Electronic devices, method for forming end terminations thereof and paste material for forming same.

摘要

An improved electronic device has metal-grazing type end terminations comprising a surface metal phase which is made of Cu and/or Ni alloy containing at least one of Pb, Su and Zn, by sintering a paste material containing a matrix metal powder (Cu and/or Ni), a fluxing metal powder (Pb, Sn and/or Zn), an inorganic bonding material powder and an organic binding material, so that the surface portion serves to improve a wettabilty and a solderability of the end termination owing to its composition similar to a solder.