发明名称 |
Method for replacing semiconductor chips. |
摘要 |
<p>To replace a face-down bonded and resin encapsulated semiconductor chip with ease and without lowering reliability. A face-down bonded semiconductor chip 4 encapsulated with a resin 14 is removed from the substrate 2 with a cutting end mill 26. The resin 14 and bump electrodes 6 remaining on the substrate 2 are then cut with a finishing end mill to a height of about one half of the original height to planarize the surface. Another chip 4A having bump electrodes 6A is aligned with the bump electrodes 6 on the substrate 2, and bonded face down on the substrate. Finally, resin 14A is flowed into the gap between the chip 4A and the substrate 2 and around the chip 4A to encapsulate the chip. <IMAGE></p> |
申请公布号 |
EP0548603(B1) |
申请公布日期 |
1995.09.27 |
申请号 |
EP19920120518 |
申请日期 |
1992.12.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
TSUKADA, YUTAKA |
分类号 |
H01L21/56;H01L21/60;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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