| 摘要 |
PURPOSE:To provide a radiation-sensitive resin composition capable of forming a negative type resist film excellent in sensitivity, developing property, film residual factor, heat resistance, chemical resistance, adhesion to a substrate, and transparency in the visible light region. CONSTITUTION:This radiation-sensitive resin composition contains (A) a copolymer of (a-1) unsaturated carboxylic acid and an epoxy group-containing radical polymerization compound (a-2) expressed by the formula and another radical polymerization compound capable of being polymerized with (a-1), (a-2) when required, (B) a polymerization compound having ethylene unsaturated double bond, and (C) a photo-polymerization initiator, where each of R<1>-R<3> is an alkyl group having hydrogen or an alkyl group having the number of carbon atom of 1-10, and (m) is an integer of 1-5, in the formula. |
